XCVM1502-2LSEVFVC1760
XCVM1502-2LSEVFVC1760
Dash number
122-XCVM1502-2LSEVFVC1760-ND
Product classification
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Type
IC VERSALPRIME
Encapsulation
Package
Tray
RoHS:
NO
Quantity
500
$9,951.2500
Minimum: 1
Multiple: 1
Quantity
Price
Total
1
$9,951.2500
$9,951.2500
XCVM1502-2LSEVFVC1760 Information
Specifications
PDF1
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed450MHz, 1.08GHz
RAM Size256KB
Operating Temperature0°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
86-0755-82705566